3030 emc uva led 365nm 395nm smd diode
Ceramic substrate packaging Adopt the latest EMC packaging technology, the package size is 3030, and the table Surface sap
phire glass packaging technology, high-purity ultraviolet light, etc
Chip type: 365nm vertical chip, 395nm Chip type: horizontal chip
Lighting angle: flat 120°
365-370NM :160-180mW@100mA, 395-400NM 120mW@100mA
Support surface mount technology (SMT)
Size: 3.0mm×3.0mm×0.9mm
Forward voltage VF: 3.6 -4.0V
DC forward Current IF :150 mA
Reverse voltage:5V
Light emitting angle 2θ :120 °
Thermal :5 °C /W
resistance electrostatic protection（HBM) ESD :2000V
Junction temperature Tj:115℃
Applicable to: Verification, Mosquito control,Nail Art,Curing,PCB exposure, printing, electronic curing and other application markets.
